The batteries have to store a lot of energy in a small, light package, scoring high in a quality known as energy density.
新型电池必须在轻小的电池组里储存大量电能，在能量密度上表现出高评分。
This paper presents some types of high density package, describes their general constructions and also shows the outline standards of these packages.
本文叙述了高密度封装的类型，介绍了它们的一般结构，并提供了封装的外形标准。
The designing and idea of developing top grade high counts and high density poplin fabrics are introduced, such as yarn selection, texture design, package dyeing, weaving and mercerizing process.
介绍了纯棉高支高密液氨潮交联免烫府绸面料的开发技术，如纱线选择、规格设计、筒子纱染色、织造和丝光工艺等；
Quad Flat No-lead(QFN)package of microwave chip is a relatively new packaging. It offers a small size and especially fits for high density printed circuit assembly.
QFN封装的微波芯片采用一种较新的封装形式，这种封装体积很小，特别适合高密度印刷电路板组装。
Quad Flat No-lead(QFN)package of microwave chip is a relatively new packaging. It offers a small size and especially fits for high density printed circuit assembly.
QFN封装的微波芯片采用一种较新的封装形式，这种封装体积很小，特别适合高密度印刷电路板组装。
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