Electroplating uneven thickness: refers to the actual plating out when the film thickness in high and low, or uneven distribution.
电镀厚度不均:指实际镀出膜厚时高时低,或分布不均。
SVC not only has a high time complexity but also gets low recognition rate when distribution of the data set is complex and uneven.
SVC算法不仅时间复杂度高,而且在处理分布复杂、不均匀样本时,识别率较低。
SVC not only has a high time complexity but also gets low recognition rate when distribution of the data set is complex and uneven.
SVC算法不仅时间复杂度高,而且在处理分布复杂、不均匀样本时,识别率较低。
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