This development of build up-type multilayer PWB is supported by HDI materials' technology, as well as processing technology for fine-pitch circuit formation and fine-via formation.
HDI材料技术、细间距电路形成和微导通孔形成的加工技术支持了积层多层板的开发。
This development of build up-type multilayer PWB is supported by HDI materials' technology, as well as processing technology for fine-pitch circuit formation and fine-via formation.
HDI材料技术、细间距电路形成和微导通孔形成的加工技术支持了积层多层板的开发。
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