Typical chemical mechanical polishing (CMP) of copper layers on semiconductor devices involves using a hard pad in the first step and a soft pad for the barrier layer removal step.
半导体器件上铜层化学机械抛光(CMP)的第一道工序一般需要使用一块硬抛光垫，在磨去阻挡层的工序中要用到软垫。
The heel crash pad absorbs shock on hard surfaces, and the trail Shield layer protects your foot from uneven trail debris.
足跟垫吸收碰撞冲击硬表面，和开拓者屏蔽层保护您的徒步不平衡线索碎片。
If the drums will be hit medium to hard, you'll usually want to enable the mic's built-in attenuation (" pad ") switch. This helps minimize the chance of distortion.
如果鼓被越来越有力度的击打，我们经常会希望把麦克内置的衰减开关打开，这样会帮助减少失真的机会。
If the drums will be hit medium to hard, you'll usually want to enable the mic's built-in attenuation (" pad ") switch. This helps minimize the chance of distortion.
如果鼓被越来越有力度的击打，我们经常会希望把麦克内置的衰减开关打开，这样会帮助减少失真的机会。
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