A circuit model of a semiconductor laser (LD) amplifier is presented. The model enables the analysis of the characteristics of a LD amplifier using general circuit analysis software.
给出了半导体激光(LD)放大器的电路模型，使得对半导体激光放大器的特性可以用通用电路分析软件进行分析。
The general structure of semiconductor manufacturing system and solutions of its information exchanging are presented.
炉管区是半导体制造过程中用于热处理的重要区域。
This paper describes the internal circuit of the DIP-CIB module, semiconductor chip technologies, package technologies and general purpose inverter design by using HVIC and the DIP-CIB module.
在此详细介绍了DIP -CIB模块的内部电路、半导体硅片技术、封装技术，以及如何配合专用的HVIC来实现通用变频器的小型化设计。
Penny Zhang, General Manager, Shanghai Still Semiconductor Testing co., Ltd.
张宛平，总经理，上海依然半导体测试有限公司。
In quantum device, general situation semiconductor self-spining device are introduced.
在量子器件方面，主要介绍量子器件和半导体自旋器件的概况。
The general structure of semiconductor manufacturing system and solutions of its information exchanging are presented.
针对半导体晶圆制造系统中瓶颈设备动态漂移的特性，提出一种动态瓶颈实时派工策略。
The general structure of semiconductor manufacturing system and solutions of its information exchanging are presented.
针对半导体晶圆制造系统中瓶颈设备动态漂移的特性，提出一种动态瓶颈实时派工策略。
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