The basic principle of simple high strain pile test method transformed from measured free fall of drop hammer is given in this paper.
给出测量自由落锤的加速度换算高应变试桩的动力的简易法的基本原理、测试操作与工程应用。
The methodologies for free drop test and bending test are introduced, considering the important effect of mechanical stress on the reliability of lead-free BGA packaging.
着重研究了机械冲击和应力对无铅BGA 封装焊点可靠性的影响，介绍了BGA 封装的可靠性力学试验（跌落、弯曲试验）及其分析方法。
The sequential thermal cycling (TC) and drop impact test is more reasonable to evaluate the reliability of lead-free solder interconnections compared with single TC test or drop impact test.
焊料微互连在热周期和跌落冲击顺序载荷下的可靠性研究更具有实际意义。
The sequential thermal cycling (TC) and drop impact test is more reasonable to evaluate the reliability of lead-free solder interconnections compared with single TC test or drop impact test.
焊料微互连在热周期和跌落冲击顺序载荷下的可靠性研究更具有实际意义。
应用推荐