The bond pad (28) is then formed in contact with the barrier (26), and a wire bond (30) is then made to the bond pad (28).

随后形成接合焊盘（28）以接触阻挡（26），且随后对接合焊盘（28）完成线接合（30）。

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The bond pad (28) is then formed in contact with the barrier (26), and a wire bond (30) is then made to the bond pad (28).

随后形成接合焊盘（28）以接触阻挡（26），且随后对接合焊盘（28）完成线接合（30）。

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