So to produce the suitable low profile electronic copper foil for high density circuit board (HDI) is more difficult and pressing.
要生产出适合于高密度电路板(HDI)使用的低轮廓电子铜箔更加困难和紧迫。
It firstly heats and softens the plastic sheet and covers it onto the shoetree, then USES vacuum suction method to profile to shape of the shoetree with the plastic foil.
本机将塑料胶片加热软化后，覆盖在鞋楦上，利用抽真空的方法，将鞋楦的形状覆制。
It firstly heats and softens the plastic sheet and covers it onto the shoetree, then USES vacuum suction method to profile to shape of the shoetree with the plastic foil.
本机将塑料胶片加热软化后，覆盖在鞋楦上，利用抽真空的方法，将鞋楦的形状覆制。
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