Copper wiring goes in one heap, aluminium foil in another.
铜线一堆，铝片另一堆。
A number of scientists, yet, are focussing on the improvement of graphene growth over transition metal substrate such as copper foil substrate.
但一些科学家仍致力于改进借助过渡金属基质的石墨烯生产方法，比如说借助铜箔基板。
The resistance of the copper rate is low, so in printed circuit board, used to prepare copper foil and double panel, produce multilayer prototypes via metallization copper with on the process.
金属铜的电阻率低，所以在印制电路板中，用来制备铜箔及双面板、多层板的孔金属化方面采用镀铜工艺。
The test on copper foil in winding shows the monitoring method is effective, and the device can find flaws such as burr, Nick, and pinhole.
对箔绕机上的铜箔试验表明该方法有效可行，能监测铜箔表面的毛刺、划痕及小孔等质量缺陷。
Equivalent heat conductivity of PWB is related to the thickness of PWB, the residual ratio of copper foil and the thickness of copper foil.
PWB的等效导热系数与PWB的总厚度、铜箔剩余率及铜箔厚度有关，设计时需考虑相关因素。
The situation of the copper foil applied to transformers is introduced. The economy, characteristics and types of the transformer with foil windings are presented.
介绍了铜箔在变压器应用的现状，概述了箔式绕组变压器的种类、特点及经济性。
The relationship of the welding seam microstructure of the drum cathode and the light region forming on the copper foil surface was studied.
研究了阴极辊焊缝处组织与电解铜箔表面上形成的光亮带之间的关系。
The results indicate that the reducing reaction of electrolyte on the foil with rough surface is much visible than on that with shiny surface, the dissolution potential of matte copper foil is 0.
结果表明，电解液在毛面铜箔表面发生还原反应的程度比在光面铜箔表面显著，其阳极溶解电位比光面铜箔约低0。
The ideal formula of the adhesive is determined by series of experiments and the reaction process and thermal stability of copper foil adhesives are studied by te, TGA and DTA.
通过一系列研究确定了胶粘剂的理想配方，并通过红外光谱、热失重和差热分析法对其铜箔胶粘剂的反应过程和热稳定性进行了探讨。
Various insulating materials as electronic shield materials, PVC, film, Mylar , copper foil . aluminum foil, foam, ect.
电子屏蔽材料、PVC 、胶片、麦拉纸、铜箔、铝箔、泡棉等多种绝缘材料。
The performance experiments on separate heat exchanges and integrated air conditioners before and after optimizing the inner grooved copper tube and reducing the thickness of aluminum foil are made.
对内螺纹铜管尺寸优化、铝箔厚度减薄前后的空调热交换器进行了单体性能实验和整机性能实验对比。
From the view of the raw materials used for manufacturing DCB plate, the influence of copper foil and ceramic material on the properties of DCB is studied.
从原材料的角度，研究了制作DC B板所使用的铜箔和陶瓷材料对其性能的影响。
In order that the foil does not fall apart, each transparent ring is actually a series of curved slots in the copper rather than a continuous gap.
为了不让铜箔散开，每一个透明的环实际上都是铜箔里的一系列的曲线轮槽，而不是连续的空隙。
The technical measures to improve roughness copper foil and strengthen dispersion of carbon black were introduced.
介绍了提高铜箔粗化度及加强碳黑分散的工艺措施。
Both copper foil and brass plate have the phenomenon of dezincification, the copper foil had more serious corrosion than brass plate than in the acid environment.
铜箔和黄铜板都有脱锌腐蚀的现象发生，铜箔在酸性气体中的腐蚀程度比黄铜板要严重的多。
After the plating, corrosion resistance, heat resistance and binding strength of electrolyte copper foil were improved.
经过处理后的电解铜箔耐蚀性、耐热性和粘合强度等性能指标均有明显提高。
Set up in 1955, Yates foil USA, Inc. was the first company in the world manufactures electrodeposited copper foil for Print Circuit Boards industry.
美国耶兹铜箔公司创始于1955年，是全世界第一家制造电路板的电解铜箔厂。
The statue of Zhang is forged of fine copper and applied with gold foil, 8.5m high, magnificent and stately.
天师像由纯铜锻造贴真金箔制作而成，像高8.5米，通体华丽，宝像庄严。
A Tiffany style lamp will be recognized by the distinctive stained glass shade, made with pieces of stained glass soldered together using copper foil.
蒂凡尼款式的灯被认可，与众不同的彩色玻璃灯罩，使用铜箔与彩色玻璃的展品焊接在一起。
In spot welding of enameled wire to copper foil, selecting the appropriate welding electrodes and controlling the welding energy precisely are very important.
在铜箔漆包线的点焊中，选取合适的焊接电极和焊接能量进行精密控制非常重要。
The influence of copper foil surface quality on electrical performance of power transformer is analyzed, the key technology for monitoring the surface flaw with machine vision system is studied.
分析铜箔表面质量缺陷对电力变压器电气性能的影响，研究采用机器视觉系统对铜箔表面质量缺陷监视的关键技术。
The copper foil board base paper is the fundamental material to product the paper of printing line board, and also is a kind of higher degree special industrial paper.
覆铜箔层压板原纸是生产印刷线路板用全纸基覆铜箔层压板的基础材料，是一种生产难度较高的特种工业用纸。
The research and production of copper foil board base paper not only changes the construction of the production in papermaking industry, but also increases the economical benefit.
覆铜箔层压板原纸的研究与生产，对造纸业改变产品结构，提高经济效益有着较大的现实意义。
Flyers that have tackled this issue claim that a copper foil shield around the camera is an easy remedy.
已经解决了这个问题，传单宣称相机周围的铜箔屏蔽是一个简单的补救措施。
This paper brief introduces the Physical chemistry process of heterogeneous response in the technical process of copper dissolved for produced process of electrodeposited copper foil.
该文简要地介绍了电解铜箔生产的溶铜工艺过程中多项反应的物理化学过程。
The alloy coating obtained is used as the barrier layer of wrought rolled copper foil in PCB manufacturing.
该锌-镍合金作为印制板用压延铜箔的阻挡层。
This paper introduces new technical achievement for waster water reutilization in electrodeposited copper foil production process.
文章介绍了在电解铜箔的生长过程中所产生的废水回收再利用的新技术成果。
This paper introduces new technical achievement for waster water reutilization in electrodeposited copper foil production process.
文章介绍了在电解铜箔的生长过程中所产生的废水回收再利用的新技术成果。
应用推荐