Flip chip technology has become one of the major joining technologies in electronic packaging.
摘要覆晶技术已成为电子构装中之主要接合技术之一。
Flip chip technology has become one of the major joining technologies in electronic packaging.
覆晶技术已成为电子构装中之主要接合技术之一。
Flip Chip on Board (FCOB) has been used widely as a microelectronics packaging structural form.
板上倒装芯片(FCOB)作为一种微电子封装结构形式得到了广泛的应用。
Underfill technology effectively enhances the flip-chip cycle fatigue life and reliability of packaging process.
基 板上的倒装芯片一般采用底部填充技术以提高其封装的可靠性。
Underfill technology effectively enhances the flip-chip cycle fatigue life and reliability of packaging process.
基 板上的倒装芯片一般采用底部填充技术以提高其封装的可靠性。
应用推荐