Lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit Flip Chip packages.
集成电路倒装芯片封装中半导体芯片及载体之间形成可靠联接所用焊料中的铅。
Lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit Flip Chip packages.
集成电路倒装芯片封装中半导体铸模和载波器的焊料中的铅；
Electromigration induced Cu dissolution in flip chip Packages The phenomenon of Cu dissolution induced by electromigration at flip chip solder joints is reported.
覆晶封装中电迁移效应导致之铜溶解现象本論文报导覆晶封装之焊点中电迁移所引起之铜垫层快速溶解现象。
With optimized circuit design and bump layout, high performance transmission lines for flip chip packages can be achieved using dry film as the masking material for the bump plating.
本实验显示经过最佳化的传输线路设计与凸块分布，低成本高效能的覆晶封装结构目标可以达成。
With optimized circuit design and bump layout, high performance transmission lines for flip chip packages can be achieved using dry film as the masking material for the bump plating.
本实验显示经过最佳化的传输线路设计与凸块分布，低成本高效能的覆晶封装结构目标可以达成。
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