This paper describes the characteristic and fabrication technology of COF(Chip on Film)tape for large-scale LCD(Liquid Crystal Display), and fine pitch wiring formation technology.
概述了大型液晶显示用COF带的特征和制造技术以及细节距线路形成技术。
This development of build up-type multilayer PWB is supported by HDI materials' technology, as well as processing technology for fine-pitch circuit formation and fine-via formation.
HDI材料技术、细间距电路形成和微导通孔形成的加工技术支持了积层多层板的开发。
This development of build up-type multilayer PWB is supported by HDI materials' technology, as well as processing technology for fine-pitch circuit formation and fine-via formation.
HDI材料技术、细间距电路形成和微导通孔形成的加工技术支持了积层多层板的开发。
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