Internal and outsource wafer sort/final test support, abnormal yield analysis.
中测、成测生产线支持，成品率异常分析。
In the last two years, Electroglas has made major new technology introductions for 200mm and 300mm wafer probing and final test handling.
在过去的两年中，伊智主要为200mm和300 mm晶圆探针台和封装测试处理引入了新的技术。
In the last two years, Electroglas has made major new technology introductions for 200mm and 300mm wafer probing and final test handling.
在过去的两年中，伊智主要为200mm和300 mm晶圆探针台和封装测试处理引入了新的技术。
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