Other example embodiments include layer thicknesses in excess of those used in normal semiconductor processing.

其他示例实施例包括厚度超过了在通常的半导体工艺中使用的厚度的层。

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Other example embodiments include layer thicknesses in excess of those used in normal semiconductor processing.

其他示例实施例包括厚度超过了在通常的半导体工艺中使用的厚度的层。

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