• This paper introduces a novel submicron etching technology for emitter window.

    介绍了一种新的亚微米发射极窗口刻蚀工艺。

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  • The method utilizes the soft etching technology to process the exposed contact area.

    所述方法利用软蚀刻技术加工所述暴露的接触区。

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  • Then, a micro exhaust duct was etched on an electroforming deposit through mask etching technology.

    然后利用掩膜腐蚀方法在铸层上腐蚀出微排气通道。

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  • Some binary optical elements were manufactured by parallel direct writing and inductive couple plasma etching technology.

    利用并行直写技术与感应耦合等离子刻蚀技术制作了部分二元光学元件。

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  • At present, the semiconductor devices used in the manufacturing process of etching technology, in the lab has produced sub-micron mechanical components.

    目前,利用半导体器件制造过程中的蚀刻技术,在实验室中已制造出亚微米级的机械元件。

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  • So we have adopted the laser etching technology to embellish the surface of amorphous silicon solar cells, and the efficiency of solar cells is greatly improved.

    我们采用该直扫技术,对非晶硅太阳电池硅膜表面绒面处理,可较大提高电池效率。

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  • Evanescent wave fiber-optic sensors (EWFS) with acicular encapsulation were fabricated using silicon photolithography technology and silica wet-etching technology.

    用硅光刻工艺和二氧化硅湿法腐蚀工艺制作了针状封装结构的光纤消逝场传感器。

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  • The fabrication methods of MPC include electron beam lithography with subsequent evaporation and lift-off, interference lithography with dry-etching technology etc.

    制备金属光子晶体方法包括:电子束刻蚀结合后续剥离法、激光干涉光刻结合干刻蚀技术等。

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  • During fabrication of the NEMS probes, KOH anisotropic etching technology has been developed for the formation of suitable silicon island with top size within 0.5 to 0.8m.

    在器件制造的过程中,采用KOH各向异性腐蚀硅尖技术制造出了顶部尺寸在0.5~0.8微米范围内符合要求的硅岛;

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  • Regular textured silicon surfaces with various shape and different geometrical parameters were successfully designed and prepared using inductively coupled plasma (ICP) etching technology.

    采用感应耦合等离子体刻蚀技术实现了不同形状和几何参数的规则织构化硅片表面的构筑与制备。

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  • The technology used for making the objects is that of bending metal tubes and wood etching.

    制作那个物体用到的技术有金属管弯曲和木料蚀刻。

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  • The technology process and mechanism of etching are also discussed in detail with examples of hollowing board process.

    结合镂空板工艺实例,详细介绍了工艺过程,并讨论了取得的效果与蚀刻机理。

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  • In addition to traditional technology like silk screen printing metal and metal etching, we also make digital printing, which has been applied into many big-size international companies.

    除了传统的技术,如丝网印刷的金属和金属蚀刻,我们也做数码印刷。这项技术已经应用在了多间国际大公司的身上。

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  • Using IC-compatible silicon as substrate and MEMS processing technology, it is fabricated with silicon wet etching and SU8 micro reaction pool.

    以与IC兼容的硅作为基底材料,利用MEMS加工工艺,采用硅腐蚀及SU8微反应池方法制成了新型微电极传感器。

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  • Principles of microwave ECR plasma technology are introduced briefly. Present development of it'S research and applications in system manufacturing, CVD, PVD and etching is reviewed.

    本文简要介绍了微波ECR等离子体技术的原理,评述了近年来这种技术在CVD、PVD、刻蚀等方面的研究和应用的进展。

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  • Compared with traditional technology, the present invention has the advantages of shortened etching time, raised etching efficiency, regular edge of resistance stripes and high graph quality.

    本发明与传统的方法相比,缩短了刻蚀的时间,提高了刻蚀工艺的效率,电阻条边缘整齐,图形质量高。

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  • The latest advance of the dry etching for submicron fabrication in ULSI production and interrelated technology are introduced.

    综述了亚微米、深亚微米干法刻蚀和相关技术的最新进展及其在超大规模集成电路制造中的应用。

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  • Now etching has be-come the standard technology, and etching equipment is the key equipment in IC production.

    目前,刻蚀技术已经成为集成电路生产中的标准技术,干法刻蚀设备亦成为关键设备。

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  • Some new techniques are adopted, for example, technology of dual-face alignmental silicon etching and anisotropic corrosion (micromachine), etc.

    采用双面对准光刻工艺,各向异性腐蚀微机械加工制硅膜片等新技术。

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  • The paper introduces emphatically the making step and method of X -ray lithograph etching in LIGA technology.

    着重介绍了LIGA工艺中X射线光刻掩模的制作步骤和方法。

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  • Technology: major soft enamel, bite version (etching), stamping, injection from (fill oil), silk screen, Dijiao, die casting, Kirschner printing.

    主要工艺有:软珐琅、咬版(蚀刻)、冲压、注漆(填油)、丝印、滴胶、压铸、柯式印刷等。

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  • The simulation results provide a theoretic guide for the fabrication of metallic nano-hole array by PS sphere's etching and vacuum depositing technology.

    模拟结果为用PS球刻蚀技术制备金属纳米孔阵列的实验提供了理论支持。

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  • In the paper, computer aided design (CAD) technology is used to achieve simulation of sacrificial layer etching.

    本文将利用计算机辅助设计(CAD)技术实现腐蚀过程的模拟。

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  • Some polymer materials are used as substrate. Kinds of new microfabrication technology are presented, including lithography, soft etching, LIGA, DEM and bonding, etc.

    系统介绍了芯片实验室的各种制备技术,这些技术包括紫外光刻、软刻蚀、LIGA技术、DEM技术、键合等。

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  • With the development of Printed Circuit Board (PCB), liquid photo imageable etching resist ink has become the prime process technology of the fine line graph facture.

    随着印制电路板(PCB)行业的飞速发展,液态光致抗蚀油墨已逐渐成为精细导线图形制作的主要方法。

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  • A patterned DLC thin film cathode was fabricated by reactive -ion etching method and mic ro -fabrication technology.

    通过离子束技术和微细加工技术可以实现DLC薄膜的图形化并能大大提高薄膜的场发射性能。

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  • The effects of current density on the main properties of iron coating were investigated by using low-temperature iron plating technology without pre-etching.

    采用无刻蚀低温镀铁技术,研究电流密度对铁镀层主要性能的影响。

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  • In chapter 3, the process technology of silicon mold by means of photolithography and wet etching was introduced, which is a important process of hot embossing technology.

    第三章介绍的是热压工艺中的一个重要工艺环节——硅阳模制作工艺。

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  • The mask design and the wet etching are both key processes in the technology introduced.

    在整套工艺环节中,光掩模版图设计和湿法腐蚀是两个关键步骤。

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  • A technology based on plasma etching has been developed to produce antireflective surface structures.

    提出一种基于等离子体刻蚀的技术,形成减反射表面结构。

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