A simple dynamic chemical etching device based on siphon principle is developed for fabrication of optical fiber probes which are commonly used in near-field optical microscopy.
基于虹吸原理，设计了一种动态化学腐蚀法的简易装置，用于制备近场光学显微镜光纤探针。
The device USES a deep etching with a shallow etching to shield the "static mirror" effect.
该器件采用一次深刻蚀与一次浅刻蚀，从而屏蔽掉“静态镜面”的影响。
After etching the surface of GaAs chip could be smooth and the isolation grooves have little edges, which can completely meet the requirements of device design.
腐蚀后芯片表面平整度、侧蚀等指标初步达到器件设计的要求。
As the key device of a DWDM system, Etching Diffraction Grating (EDG) is one of the most potential types of planar waveguide DWDM devices.
作为波分复用中最关键的器件，蚀刻衍射光栅(EDG)是平面波导密集波分复用器件中很有发展潜力的一种。
Etching requirements for those structures are given and optimal EPW wet etching condition and speed are obtained through experiments, which insure controllability and good quality of device structure.
根据探测器结构提出了对腐蚀工艺的要求，采用EPW湿法腐蚀的工艺，通过实验研究器件结构制作的最佳腐蚀条件和腐蚀速度，保证了工艺的可控性和器件结构的质量。
The invention can improve the micro-loading effect while etching the grooves in the process manufacturing the stress metal oxide semiconductor device.
本发明可改善应变金属氧化物半导体器件的制造中刻蚀沟槽时的微负载效应。
According to the hydraulic transmission principle, a device for fabricating large cone Angle near-field optical fiber probe by means of dynamic chemical etching is developed.
基于液压传递原理，设计出一种用动态化学腐蚀法制备大锥角近场光纤探针的装置。
The invention reduces the threat of generating defects on a semiconductor device in the subsequent etching process and improves the quality of the semiconductor device.
本发明减小了后续刻蚀过程中在半导体器件上产生缺陷的威胁，提高了半导体器件的质量。
The method for the graphic input in a laser-induced thermal etching system and writing device is described.
介绍了激光蚀刻、书写设备中的图形输入方法，着重讨论了图像预处理、直线段识别和圆弧识别的数学方法。
The invention relates to a surface treatment method of plastic components, comprising the following steps: providing an inkjet device housing etching solution inside;
本发明涉及一种塑胶元件表面处理方法，该方法包括：提供一喷墨装置， 该喷墨装置内收容有蚀刻溶液；
Device Processing: Etching. Surface passivation; dielectric films.
元件制程：蚀刻，表面钝化，介电材料薄膜。
Device Processing: Etching. Surface passivation; dielectric films.
元件制程：蚀刻，表面钝化，介电材料薄膜。
应用推荐