• A first nitride etch stop layer is deposited over the substrate.

    第一氮化物蚀刻终止沉积衬底上。

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  • A second nitride etch stop layer is deposited over the first nitride etch stop layer.

    第二氮化物蚀刻终止沉积第一氮化物蚀刻终止层上。

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  • The existence of rigid etch stop layer helped to reduce the thermal stress and plastic strain.

    刚性蚀刻停止存在有助于减少互连线应力塑性应变

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  • An opening is formed at the second metal layer above the etch stop layer to expose the etch stopping layer.

    蚀刻停止上方第二金属形成开口使蚀刻停止层暴露出来。

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  • The first plate electrode is formed on a second inner connection structure provided under the dielectric etch stop layer.

    第一平板电极形成于设于该介电蚀刻停止第二连接结构之上。

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  • A first interlayer conductive joint hole is formed on and through an interlayer dielectric layer and a dielectric etch stop layer.

    第一导电形成穿过层间介电以及一介蚀刻停止层。

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  • The second plate electrode is formed above the dielectric etch stop layer, and is approximately in parallel with the first plate electrode, and overlaps the first plate electrode.

    第二平板电极形成于介电蚀刻停止层上大致第一平板电极平行相重叠

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  • The second plate electrode is formed above the dielectric etch stop layer, and is approximately in parallel with the first plate electrode, and overlaps the first plate electrode.

    第二平板电极形成于介电蚀刻停止层上大致第一平板电极平行相重叠

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