Thyristor power supply with ripple percentage equal to or less than 4.18% is suggested to meet anodizing and electroplating processes requirements.
认为晶闸管整流桥电镀电源需具有等于或小于4.18%的纹波因数值才能满足一些氧化和电镀工艺的要求。
Effects of current form on electroplating processes were elucidated. Specifications of the rectifiers for different plating processes were recommended.
阐述了电流波形对电镀工艺的影响，对不同的电镀工艺选用不同规格的整流器提出了建议。
Electroplating processes of Au, Au-Sn, Sn-Pb, Sn-Ag and chemical nickel-plated bumpings are described in particular. And finally, electroplating equipments for bumping formation are introduced.
着重介绍了电镀金、金锡、锡铅、锡银和化学镀镍凸点的工艺过程，最后简单介绍了制备凸点的电镀设备。
Electroplating processes of Au, Au-Sn, Sn-Pb, Sn-Ag and chemical nickel-plated bumpings are described in particular. And finally, electroplating equipments for bumping formation are introduced.
着重介绍了电镀金、金锡、锡铅、锡银和化学镀镍凸点的工艺过程，最后简单介绍了制备凸点的电镀设备。
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