Thyristor power supply with ripple percentage equal to or less than 4.18% is suggested to meet anodizing and electroplating processes requirements.
认为晶闸管整流桥电镀电源需具有等于或小于4.18%的纹波因数值才能满足一些氧化和电镀工艺的要求。
Effects of current form on electroplating processes were elucidated. Specifications of the rectifiers for different plating processes were recommended.
阐述了电流波形对电镀工艺的影响，对不同的电镀工艺选用不同规格的整流器提出了建议。
Electroplating processes of Au, Au-Sn, Sn-Pb, Sn-Ag and chemical nickel-plated bumpings are described in particular. And finally, electroplating equipments for bumping formation are introduced.
着重介绍了电镀金、金锡、锡铅、锡银和化学镀镍凸点的工艺过程，最后简单介绍了制备凸点的电镀设备。
Surface treatment of zinc casting artworks such as electroplating and colouring processes as well as composition of the solutions is described.
介绍锌合金铸造工艺品的电镀、着色等表面处理工艺和处理溶液的组成。
Copper electroforming and nickel electroforming processes were compared with copper electroplating and nickel electroforming process respectively.
对电铸铜与电镀铜工艺、电铸镍与电镀镍工艺进行了比较。
The whole processes of gun black electroplating, including solution constitution and preparation, processing regulations and performing cautions, were discussed in detail.
详细介绍了枪黑电镀工艺全过程，包括配方、溶液配制、工艺规程及操作注意事项等。
Actuality, theory, and property of plating processes on magnesium alloys were introduced, such as electroplating, chemistry plating and dry plating.
介绍了镁合金表面化学镀、电镀、干法镀等工艺的基本原理、工艺特点和国内外研究现状。
The products by drop forged, cold stamped, heat treatment, polishing, grinding, electroplating and other processes.
产品经锻打、冷压、热处理、抛光、研磨、电镀等工艺。
The products by drop forged , cold stamped, heat treatment , polishing, grinding , electroplating and other processes.
产品经锻打、冷压、热处理、抛光、研磨、电镀等工序。
The present invention can be widely used in the waste water treatment processes of various electroplating effluent.
本发明可广泛应用于各种电镀厂的废水处理过程中。
The present invention can be widely used in the waste water treatment processes of various electroplating effluent.
本发明可广泛应用于各种电镀厂的废水处理过程中。
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