In this paper, new progress of electronic packaging technology is presented.
本文综述了电子封装技术的最新进展。
The microelectronic packaging technology is an important technology that affects performance, size, price and reliability of final electronic products.
微电子封装技术是一项重要的技术，这项技术直接影响最终电子产品的性能、外形尺寸、价格及可靠性能。
It is noted that microelectronic packaging technology becomes one of the most important and challenging technologies in radar and all other electronic products.
令人瞩目的是微电子组装技术正在成为现代雷达及其他电子设备中最重要的关键技术之一。
Flip chip technology has become one of the major joining technologies in electronic packaging.
摘要覆晶技术已成为电子构装中之主要接合技术之一。
Flip chip technology has become one of the major joining technologies in electronic packaging.
覆晶技术已成为电子构装中之主要接合技术之一。
With technology of low temperature co-fired ceramic going mature gradually, it evolves to investigative hot spot in the field of electronic packaging.
低温共烧陶瓷(L TCC)技术目前正逐渐走向成熟，并成为电子封装领域研究的热点。
Laser soldering technology has been found an important application in micro-electronic joining and packaging.
激光软钎焊技术在微电子焊接和封装方面具有重要的应用价值。
Application of modern optics technology in printing process, ct anti counterfeit packaging, electronic publish, paper counting, bar code etc. is presented.
论述了现代光学在印刷工艺、全息防伪包装、电子出版、纸张计数、条形码等方面的应用。
Application of modern optics technology in printing process, ct anti counterfeit packaging, electronic publish, paper counting, bar code etc. is presented.
论述了现代光学在印刷工艺、全息防伪包装、电子出版、纸张计数、条形码等方面的应用。
应用推荐