In a method of mounting an electronic component on a substrate, electrode terminals on at least one of the substrate and the electronic component are composed of solder bumps.
在将电子组件安装在基板上的方法中，所述基板和所述电子组件中的至少一个上的电极端子由焊点组成。
In a method of mounting an electronic component on a substrate, electrode terminals on at least one of the substrate and the electronic component are composed of solder bumps.
在将电子组件安装在基板上的方法中，所述基板和所述电子组件中的至少一个上的电极端子由焊点组成。
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