A novel structure has been designed and applied in metallization system of microwave power device, in which backflow effect is taken to increase the electromigration resistance.
在回流动力学理论和实验研究的基础上，将回流加固结构应用于实际微波功率器件。
A novel structure has been designed and applied in metallization system of microwave power device, in which backflow effect is taken to increase the electromigration resistance.
在回流动力学理论和实验研究的基础上，将回流加固结构应用于实际微波功率器件。
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