The disadvantages of common electroless copper plating process were pointed out.
指出了普通镀铜工艺的缺点。
A novel technology of acidic electroless copper plating on steel matrix was studied in this paper.
研制了一种新型的钢铁基件酸性化学镀铜工艺技术。
The replacement deposition method is applied to electroless copper-plating on the magnetic fly-ash powder.
笔者采用置换反应法在粉煤灰空心磁粉表面进行了化学镀铜的研究。
Conductive Poly (ethylene terephthalate) (PET) fabrics were prepared by electroless copper and nickel plating.
采用化学镀的方法制备镀铜和镍导电涤纶织物。
The microstructure of electroless copper deposit is greatly effected by the substrate upon which deposition occurs.
化学镀铜层的显微结构受基体的显著影响。
The effect of process conditions of electroless copper plating on resistivity of silver coated nickel powder was discussed.
探讨了化学镀铜工艺条件对银包镍粉电阻率的影响。
The results show that the copper plated carbon fiber using optimized electroless copper plating process has even deposit, fine luster, good…
结果表明，采用优化后的碳纤维化学镀铜工艺制得的镀铜碳纤维镀覆均匀， 光泽性好， 镀层结合力强，导电性能显著提高。
The processing technology of electroless copper plating on graphite powders by iron powder method and formaldehyde method were studied and evaluated.
研究比较了两种化学方法——铁粉法和甲醛法在石墨粉表面镀铜的工艺。
A process for through hole plating is reviewed in which conventional electroless copper plating is replaced by deposition of a carbon black-graphite layer.
综述了一种对印制线路板通孔镀的方法，即在孔壁上沉积有电镀用的碳黑—石墨层，以取代传统的化学镀铜工艺。
Thus, the work is converted to a conductor with the solution for palladium conductor layer formation, which is neutral, without using an electroless copper plating solution which is highly alkaline.
因此，用钯导电体层形成溶液将工件转变成导体，所述溶液是中性的，不使用高碱性无电镀铜溶液。
Electroless copper depositing processess are controlled by the kinetics of formaldehyde oxidation reaction, which donate electron for the cathodic reduction of cupric ions.
化学镀铜反应受甲醛氧化过程动力学控制，甲醛氧化为铜离子还原提供电子。
Electroless copper plating was Used for graphite powder to solve the interface problem in metal7 graphite composite material manufacture and improve its comprehensive properties.
在石墨粉表面化学镀铜，以解决金属-石墨复合材料制造中的界面结合力问题并提高其综合性能。
Electroless copper plating was Used for graphite powder to solve the interface problem in metal7 graphite composite material manufacture and improve its comprehensive properties.
在石墨粉表面化学镀铜，以解决金属-石墨复合材料制造中的界面结合力问题并提高其综合性能。
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