The cross-section test and dye&pry test are adopted to study the failure mechanism of CSP lead-free solder interconnection.
采用剖样实验和染色实验对无铅焊料微互连的失效机理进行分析。
The cross-section test and dye&pry test are adopted to study the failure mechanism of CSP lead-free solder interconnection.
采用剖样实验和染色实验对无铅焊料微互连的失效机理进行分析。
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