The plastic zone size of the crack tip is relative to three dimensional constraint which depends upon not only the plate thickness but also the load and the material property.
裂纹尖端塑性区的大小与其三维约束状态有关，而三维约束状态不仅与板厚还与外载荷、材料性质有关。
Having analyzed multiple formative assessment system, exam library design and exercise library design, proposed automotive paper generation algorithm of six-dimensional constraint.
并根据多元形成性评价系统架构，设计了题库和作业库结构，提出了基于六维约束的自动组卷算法。
These dimensional changes are subject to the law of the smallest constraint.
这些尺寸变化是受法则约束最小。
Container loading is the three-dimensional problem in "cutting and packing" problems. It is combined optimization with complex constraint condition.
集装箱装入问题是“切割和装入”问题领域中的三维空间问题，是具有复杂约束条件的组合优化问题。
In this paper the problem of the controllability of a class of infinite dimensional linear systems with control energy constraint is discussed.
本文讨论控制器能量受限下一类无限维线性系统的精确零能控性问题，得到了这类能控性的充分必要条件。
In this paper, a method to build geometric constraint model of 2 dimensional drawing based on undirected graph is presented.
本文提出了一种基于图结构描述的二维图形几何约束模型的建立及存储方法。
Combined with weighted filtration to successful sample points, it uses the method of sampling in three-dimensional space and range constraint to acquire three-dimensional coordinates of nodes.
为了减小定位误差和提高算法的适应性，利用三维空间抽样和范围约束的方法，并结合对成功样本点的加权筛选，获得节点的三维估计坐标以实现抽样定位。
The general expressions of kinematic model of 3-dimensional VGCN are presented, which is the equation constraint in optimization of tolerance values.
建立了三维变动几何约束网络的运动学模型的一般表示式，从而构成了公差大小优化的等式约束。
After analysing the traditional position and constraint matrix, a judgement criterion of deterministic location for two-dimensional part and three-dimensional part has been given.
通过对定位矩阵的分析，提出了二维零件和三维零件确定性定位判断准则。
To overcome this constraint, the researchers first developed one-dimensional, single-crystal silicon electronics, which they reported in 2005.
为了克服这个限制，研究人员们首先开发了一维单晶硅电子产品。这项研究在2005年被报道。
To overcome this constraint, the researchers first developed one-dimensional, single-crystal silicon electronics, which they reported in 2005.
为了克服这个限制，研究人员们首先开发了一维单晶硅电子产品。这项研究在2005年被报道。
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