The invention provides a semiconductor device which can increase heat diffusion efficiency generated by a plurality of semiconductor chips, and connects with a heat diffusion path reliably.
本发明提供一种半导体装置，提高了从多个半导体芯片产生的热的扩散效率，并可靠地与散热路径连接。
The invention provides a semiconductor device which can increase heat diffusion efficiency generated by a plurality of semiconductor chips, and connects with a heat diffusion path reliably.
本发明提供一种半导体装置，提高了从多个半导体芯片产生的热的扩散效率，并可靠地与散热路径连接。
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