Introduction to semiconductor manufacturing technology including oxidation, diffusion, alloying, re-flow process, copper process and chemical-mechanical polishing.
半导体制程技术包括氧化、扩散、热处理、合金化、再流动制程、铜制程及化学机械研磨制程简介。
The interfacial diffusion of alloying element is important to microstructure, microhardness and interfacial bonding strength.
合金元素在界面两侧的扩散是影响材料显微组织、显微硬度及界面结合强度的关键。
The interfacial diffusion of alloying element is an important factor to microstructure, apparent hardness and interfacial bond strength.
元素在界面两侧的扩散是影响材料显微组织、表观硬度及界面结合强度的关键。
The method making powder by mechanical alloying is brought forward. Getting CuCr alloy by explosive sintering and thermal diffusion disposal are studied some primary experiments were done.
提出了采用机械合金化制粉，进而进行爆炸烧结和后续热扩散处理的制取铜铬合金的方法，并初步进行了实验研究。
The diffusion zone width of main alloying elements increases and hardness of the friction weld zone near TC4 titanium alloy side improves after post-weld heat treatment.
经焊后回火热处理后，主要合金元素沿焊合区的扩散区宽度增大；焊合区钛合金侧硬度值显著提高。
According to the energy condition of solute vacancy complex diffusion, the mechanism of solute vacancy diffusion played an important role in the double glow plasma surface alloying process.
据溶质空位复合体扩散的能量条件，提出溶质空位复合体扩散机制在双层辉光离子钨钼共渗中起重要作用。
According to the energy condition of solute vacancy complex diffusion, the mechanism of solute vacancy diffusion played an important role in the double glow plasma surface alloying process.
据溶质空位复合体扩散的能量条件，提出溶质空位复合体扩散机制在双层辉光离子钨钼共渗中起重要作用。
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