Because the composite electroplating layer containing diamond grains must be distributed on the hole surface of die, it brings some difficulties to the process.
由于含有金刚石颗粒的复合镀层要镀在胎具的内孔孔壁上，所以给电镀工艺带来一定的困难。
Because the composite electroplating layer containing diamond grains must be distributed on the hole surface of die, it brings some difficulties to the process.
由于含有金刚石颗粒的复合镀层要镀在胎具的内孔孔壁上，所以给电镀工艺带来一定的困难。
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