Is SPC used for Desmear and Electroless process? Is the corrective action taken for the out of control status?
去胶渣与化学沉铜制程是否使用SPC ？超出管控要求时，是否采取相应的改善措施？
The hole metallization of rigid-flex PCBs which including Drill, Desmear, electroless plating, Electrical plating, is a key process in the manufacturing of rigid-flex PCBs.
该孔金属化工艺是整个刚挠结合板生产制造工艺的核心，包括钻孔、去钻污、化学镀铜、电镀铜等工序。
The hole metallization of rigid-flex PCBs which including Drill, Desmear, electroless plating, Electrical plating, is a key process in the manufacturing of rigid-flex PCBs.
该孔金属化工艺是整个刚挠结合板生产制造工艺的核心，包括钻孔、去钻污、化学镀铜、电镀铜等工序。
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