Shrinkage stress was found to increase linearly with cure temperature.
我们发现收缩应力随固化温度直线增加。
Barium PF resin cure temperature is lower than that of ordinary PF resin.
钡酚醛树脂固化温度比普通酚醛树脂低；
Reflectivity of PDCLC films is up first and down later with UV cure temperature increasing.
膜的反射率先随着固化温度的升高逐渐升高，而后又降低。
The influences of cure temperature, cure time and ambient humidity on the properties of the dam blank were discussed.
探讨了养护温度、养护时间和环境湿度对坯体性能的影响。
The effect of cure temperature and rotor speed on rheological properties for epoxy resin matrix by torque rheometer are studied.
用转矩流变仪研究了温度、转速对环氧树脂基体固化性能的影响。
The effect of the levels of bisphenol AF and BPP and the cure temperature on the cure characteristic of fluorine rubber was investigated.
研究了硫化剂双酚AF、促进剂BPP用量及硫化温度对氟橡胶硫化特性的影响。
With the increasing of cure temperature, the scorch time and optimum cure time decreased, but the crosslink density had a tread of decreasing.
硫化温度的提高会缩短焦烧时间和正硫化时间，但有使交联密度下降的趋势。
Effects of different kinds of accelerators, blending ratio and cure temperature on natural rubber (NR) cured with equilibrium cure system (ec) were studied.
研究了促进剂的种类，促进剂并用及硫化温度等条件对平衡硫化体系(EC)硫化天然橡胶(NR)的影响。
The dielectric performance of the modified resin system is remarkably influenced by the concentration of catalysis, the cure temperature and toughening agent.
树脂的介电性能与树脂体系的催化剂含量、固化温度和增韧剂含量有较大关系。
Although there is no way to completely cure but through the above method to suppress the viral activity regulating water temperature can reduce the mortality rate which has brought hope.
虽然没有能够完全治愈的方法，但通过上述的方法调节水温来抑制病毒活性，可以降低死亡率，这就带来了希望。
Required cure time depends on temperature, pipe diameter, and pressure application.
所需要的固化时间与温度、管道直径和应用压力有关。
Liquid injection molding utilizes low viscosity silicones which can be pumped at lower pressure and temperature, and cure in significantly less time and with less waste than solid materials.
液体侵渍模塑使用低粘度的硅树脂，在低压和低温条件下抽运，在极短的时间内固化，与固体材料相比，废弃物少。
In this paper, one part elastic epoxy resin sealant was prepared, it has character of rapid middle temperature cure and sag resistance, especially can be applied on line production.
研究了一种单组分的弹性环氧密封胶，具有中温快速固化和抗流挂性能，尤其适应于工厂的生产流水线。
The higher the temperature is, the longer cure time is, the larger volumetric expansion will be.
并且苯并恶嗪的固化温度越高，时间越长，体积膨胀效应就越大。
The curing rate of both the free radical and cationic UV curable coatings are accelerated with the rise of temperature, and the former's cure speed is higher than the latter.
V自由基固化和阳离子固化的固化速度随温度的升高而加快，并且自由基的固化速度大于阳离子固化速度。
The real time monitoring for residual strain induced by resin cure during the RTM process was realized by measuring the relationship among wave deflection, temperature and curing time.
通过光纤光栅波长偏移与温度和固化时间之间的关系测试，得到了树脂固化过程中残余应变的变化历程，成功实现了RTM工艺树脂固化过程中残余应变的在线监测。
Immediately following the milling, the particles are vacuum dried in an oven using a temperature and time suitable to cure the product to prevent substantial aggregation over time.
紧接着铣，这些粒子是在一个真空烘干使用适当的温度和时间来治疗，以防止该产品随着时间的推移大量聚集。
The results showed that the compound needed to use peroxide vulcanization system and aid cross-linker with high temperature cure and secondary cure process.
结果表明，胶料需采用过氧化物硫化体系和助交联剂，用高温硫化和二次硫化工艺。
The alternative materials for stoichiometric cure, the acid anhydrides, by contrast are not skin irritants but they will not bring about cure unless the temperature is raised.
计量的固化，酸酐，通过对比的替代材料，不刺激皮肤，但它们不会带来约治愈，除非温度升高。
The application of programed control system of temperature at local heating of insulator for cure bonding is introduced.
介绍了温度程序控制系统在局部加热粘接瓷套中的应用 ，对控制系统的构成、工作原理作了详细的论述。
By simulating practical temperature procedure of curing, the cure kinetic equations were verified by means of determining the residual heat of reaction of samples with different cure degrees.
并模拟实际固化温度历程，采用测定不同固化阶段样品残余反应热的方法对固化反应动力学方程进行了验证。
This paper, introduces a new REDOX initiation system (BPO-DHPT) which makes methyl methacrylate resin cure effectively at room temperature.
我们发现一种新的BPO - DHPT氧化-还原引发体系能很好地引发其室温聚合，研究了其引发机理。
Technologies of low cost composite structures, including low temperature cure, liquid forming, radiation cure are put forward to solve this problem in this paper.
文章提出了低温固化、液体成型、辐射固化等几种低成本制造技术用以解决这个问题。
A semiconductor cooler with constant temperature is introduced in this paper. And it is used in clinical cure by low temperature.
介绍一种恒温控制的半导体制冷器，用于临床上的低温治疗。
The prevention and cure of temperature cracks in large concrete pier cap is a serious difficulty in quality controlling of construction.
温度裂缝防治是大体积混凝土承台施工质量控制的一大难题。
The application of programed control system of temperature at local heating of insulator for cure bonding is introduced. The scheme and operation basis of control system is presented.
介绍了温度程序控制系统在局部加热粘接瓷套中的应用，对控制系统的构成、工作原理作了详细的论述。
This paper introduces the main characteristics of SL304 photogelatin for rotary screen stenciling which can quickly cure at lower temperature.
介绍了SL304中温节能快速固化圆网制版感光胶的主要性能特点。
This product is designed to cure at low temperature and gives excellent adhesion on a wide range of materials in considerably short time.
该产品用于低温固化，并能在极短的时间内在各种材料之间形成最佳粘接力。
In the absence of activator existence and normal temperature and pressure conditions, even after a long period of flooding, inorganic non-metallic materials will not gel and cure.
在没有活化剂存在和常温常压条件下，即使经过长时间的水浸，无机非金属材料也不会凝胶和固化。
In the absence of activator existence and normal temperature and pressure conditions, even after a long period of flooding, inorganic non-metallic materials will not gel and cure.
在没有活化剂存在和常温常压条件下，即使经过长时间的水浸，无机非金属材料也不会凝胶和固化。
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