The resistance and stress of Cu film will be studied by different rotation speeds, anneal process and queue time (ECP to CMP).
通过对比电镀铜工艺中不同的转速对孔洞缺陷的影响，得到电镀时转速与孔洞缺陷的关系；
The resistance and stress of Cu film will be studied by different rotation speeds, anneal process and queue time (ECP to CMP).
通过对比电镀铜工艺中不同的转速对孔洞缺陷的影响，得到电镀时转速与孔洞缺陷的关系；
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