Based on application of theories of complexing and precipitation equilibriums and study of etching process using acidic copper chloride etching soln. , a new method of recovering Cu in etching soln.
运用络合平衡和沉淀平衡的理论，对酸性氯化铜蚀刻液的蚀刻过程进行研究，提出以铜废料作还原剂，回收蚀刻液中铜。
Calculations were made of the doped concentration "C0", of the thickness of Cu-film about Cu-treatment and of the junction areas increased by pre-etching.
根据所提出的模型及假设，计算了铜—硫化学比的失配量与掺杂浓度的关系和铜处理工艺中蒸铜层的厚度，采用误差补函数扩散模型计算了结深的增长速率。
Calculations were made of the doped concentration "C0", of the thickness of Cu-film about Cu-treatment and of the junction areas increased by pre-etching.
根据所提出的模型及假设，计算了铜—硫化学比的失配量与掺杂浓度的关系和铜处理工艺中蒸铜层的厚度，采用误差补函数扩散模型计算了结深的增长速率。
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