For increased reliability, a reduced CTE (coefficient of thermal expansion) mismatch with the PCB reduces the possibility of solder-joint cracks resulting from thermal cycles.
为提高可靠性，降低的热膨胀系数(热膨胀系数)的不匹配与PC B减少了从热循环所得的焊点的裂缝的可能性。
For increased reliability, a reduced CTE (coefficient of thermal expansion) mismatch with the PCB reduces the possibility of solder-joint cracks resulting from thermal cycles.
为提高可靠性，降低的热膨胀系数(热膨胀系数)的不匹配与PC B减少了从热循环所得的焊点的裂缝的可能性。
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