Some double crystal rocking curves of photocathode epitaxy materials and substrates are measured by means of X-ray double crystal diffraction in the bonding process.
用X射线双晶衍射仪测量了阴极和玻璃热粘结工艺过程中阴极材料外延层和衬底的双晶回摆曲线。
Lead oxide in glass used for bonding front and rear substrates of flat fluorescent lamps used for Liquid Crystal Displays (LCD).
液晶显示器中焊接前后平版萤光灯基质的玻璃中的氧化铅。
For bonding, coating and sealing many electronic products, medical devices, crystal craftworks, optical apparatus, home glassworks and workmanships.
用于电子、医疗器械、水晶工艺品、光学仪器、玻璃家具和工艺品的粘接、涂覆及密封。
The surface modification of titanium was processed by plasma electrolyte oxidation. The microstructure, crystal structure bonding strength and elastic modulus of the film were discussed.
利用等离子体氧化技术对钛进行了表面处理，并对其组织形貌、晶体结构以及结合强度和弹性模量等力学行为进行了讨论。
The X-ray analysis reveals that the crystal structures of compounds 1 and 2 are two-dimensional layer structures through intramolecular hydrogen bonding and -? stacking.
射线分析显示化合物1和2的晶体结构均由分子间氢键和-弱相互作用堆积而成的二维层状结构。
Based on the crystal structure data of 79 substituted nitrobenzenes, geometrical characteristics of hydrogen bonding were studied.
根据79个取代硝基苯的晶体结构资料，研究了其中存在的氢键的几何特点。
Lead oxide in glass used for bonding front and rear substrates of flat fluorescent lamps used for Liquid Crystal Displays (LCD).
液晶显示器(LCD)用于连接平面荧光灯前后基片用的玻璃中的氧化铅。
The influence of experimental parameters on the bonding intensity is discussed and the size of crystal is…
讨论了电爆炸喷涂实验参数对结合强度的影响，分析了涂层晶粒尺寸分布。
This study is intended to evaluate the bondability and reliability of single crystal copper wire bonding.
本研究的目的是评估单晶铜引线接合的接合性和可靠性。
From the present study, it is found that single crystal copper wires can be bonded on the gold pad and the aluminum pad by thermosonic ball bonding and wedge bonding without gas protection.
从目前的研究中，它被发现，单晶铜线材可以键合金垫和铝焊盘上由无气体保护的热超声球焊和楔焊。
The development of HIP diffusion bonding of FGH95 superalloy powder and DD3 single crystal has been explored.
主要探索采用双合金热等静压扩散连接工艺实现高温合金粉末和DD 3单晶合金间可靠连接的可行性。
The development of HIP diffusion bonding of FGH95 superalloy powder and DD3 single crystal has been explored.
主要探索采用双合金热等静压扩散连接工艺实现高温合金粉末和DD 3单晶合金间可靠连接的可行性。
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