Current design trends have shown that crosstalk issues in deep sub-micron can cause severe design validation and test problems.
超深亚微米工艺下,串扰的出现会导致在电路设计验证、测试阶段出现严重的问题。
Current design trends have shown that crosstalk issues in deep sub-micron can cause severe design validation and test problems.
超深亚微米工艺下,串扰的出现会导致在电路设计验证、测试阶段出现严重的问题。
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