The temperature field and thermal stress field on the crack tip in a metal was studied by numerical simulation method.
用数值模拟方法研究了金属裂纹尖端的温度场和热应力场的分布情况。
The size of current path, resistivity, power density are main factors that effect the temperature field and temperature gradient field at crack tip.
试件的通流尺寸、电阻率、导入电流密度是影响裂纹尖端温度场和温度梯度场的主要因素。
The complex function method is used to solve the temperature field and thermal stress field around the crack tip at the moment when the pulse current is switched on.
采用复变函数方法求解了脉冲放电瞬间裂纹尖端的温度场和热应力场。
The numerical results have shown that when an earthquake is occurring, the temperature rise near the propagating crack tip may reach several hundred to near one thousand degree.
数值结果表明，地震时传播裂缝尖端附近可产生几百度至近千度的温升。
Concerns BEM (boundary element method) of electric current concentrating effect and temperature rising analysis at the crack tip with high density electric pulse.
给出金属板在高密度电流脉冲下裂纹尖端电流集肤效应和急剧发热升温解析的边界元法。
Concerns BEM (boundary element method) of electric current concentrating effect and temperature rising analysis at the crack tip with high density electric pulse.
给出金属板在高密度电流脉冲下裂纹尖端电流集肤效应和急剧发热升温解析的边界元法。
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