The copperplating process of graphite powder was investigated and the optimum process parameters were obtained by comparing the copper-plating results.
研究了用刷镀镀铜防渗碳时的工艺参数对镀层防渗碳效果的影响 ，及渗碳时间与防渗碳所需的最小镀层厚度之间的关系。
The copperplating process of graphite powder was investigated and the optimum process parameters were obtained by comparing the copper-plating results.
研究了用刷镀镀铜防渗碳时的工艺参数对镀层防渗碳效果的影响 ，及渗碳时间与防渗碳所需的最小镀层厚度之间的关系。
应用推荐