Experiment was carried out on influence of copper stress on physiological and biochemical characteristics of Hypnum fertile and Anoectangium aestivum by indoor simulated culture.
以果灰藓和丛本藓为材料，采用室内模拟培养、生理生化测定等实验手段，研究了铜胁迫对这两种苔藓植物生理生化特性的影响。
Among all commodities, nickel and copper are under particular stress.
在所有大宗商品中，镍和铜尤其承压。
What They Do - They contain antioxidants such as Vitamin a, beta-carotene, Vitamin c, Vitamin e, selenium, zinc, copper and manganese, which are also anti-stress nutrients.
作用——上述物质含有抗氧化剂，例如维生素a、胡萝卜素、维生素c、维生素e、硒、锌、铜和锰，同时它们也是具有抗压力的营养素。
Iron and copper increase oxidative stress (free radical damage), which is a major problem in CFIDS.
增加铁和铜的氧化应激(自由基损伤)，这是一个重大问题在CFIDS。
The machining process of copper reflector is described. A processing method of "simultaneous processing of two sides and natural stress releasing" is put forth.
叙述铜反射镜的加工过程，提出“两面同时加工，自然释放应力”的加工方法。
The results indicate that neither temperature nor heat stress of copper stave under a BF operating condition are the stress formed sufficient to cause crack quickly.
计算结果表明：铜冷却壁在高炉炉况下的基体温度以及由此产生的热应力都不足以使其很快产生裂纹。
Compared with other conductive metal layer, copper coating with small with stress, high mechanical strength, the plastics substrate and coating binding force is good wait for a characteristic.
与其它导电金属层相比，镀铜层具有应力小、机械强度高、塑料基体与镀层结合力好等特点。
Shot peening is also improved the stress relaxation ability of copper alloy.
喷丸处理亦能改善铜合金的应力松弛性能。
The stress variation with temperature and isothermal relaxation in copper films deposited onto silicon wafers are studied by fixed point laser reflection method.
采用定点激光反射热循环方法，测量了硅基体上铜膜应力随温度的变化及等温松弛。
Studies of stress distribution during undercutting were carried out using Boundary Element Method for Tongkuangyu Copper Mine.
文章根据铜矿峪铜矿开采条件，运用边界元法进行了矿块崩落法拉底过程中应力分布规律的研究。
In present paper a new rotating-structure was introduced to detect local residual stress and in-plane deflection in thin cold-rolled sheet of copper alloy.
本文提出了一种转动结构用于铜合金冷轧板带残余应力检测以及面内形变的测量方法。
The forming reason and solving method of stress - corrosion cracking for brazed joint of Band pipe is studied in this paper and compared with copper- copper pipe joint at the same conditions.
本文着重研究了邦迪管钎焊接头应力断裂的形成条件以及解决方法，并比较了铜管-铜管钎焊接头在相同条件下应力断裂情况。
The results show that the aggregation of contaminant is the inner cause of Copper pipe crack, while the thermal stress formed during welding and winding deformation is another two important factors.
结果表明：夹杂物局部偏聚是铜管断裂的内在原因。焊接时产生的热应力及弯曲变形是铜管断裂的外部诱发因素。
It was concluded that the cl ion in the oil glue resulted in stress corrosion cracking of the pure copper tube.
结果表明，紫铜管渗漏系腐蚀引发裂纹所致，而涂在铜管表面的油胶中的氯离子是引起紫铜管应力腐蚀开裂的主要因素。
This paper deduced the flow stress of copper column that was under the action of static pressure, and it analyzed the influences of the pressure and temperature.
文中推导了铜柱在静压下的流动应力，分析了压力及温度对铜柱压后高的影响。
Copper busbar and busbar column should be able to sustain electric stress generated by electric current of three-phase symmetrical short-circuit of 50 kiloampere and above.
铜母线和母线支柱应能承受50千安及以上的三相对称短路电流所产生的电应力。
Objective To explore the effects and possible mechanism of copper pre-administration on stress ulcer.
目的：探讨铜预投对应激性胃溃疡的影响及可能的机制。
Pure copper is a superior structural material for cryogenic purposes. But it has been found that in the case of special conditions, pure copper can also suffer stress corrosion cracking.
纯铜是一种深冷温度下应用的优异结构材料，但在特定条件下产生了应力腐蚀开裂。
The main reason for cracking is liquid copper diffused into the austenite grain boundary and grain boundary embrittlement was caused, so the welded pipe cracked under stress.
开裂主要原因为液相铜扩散进入奥氏体晶界引起晶界脆化，在应力作用下引起焊管开裂。
This study focuses on the dynamic buckling of a nano crystal copper wire under compression stress wave.
用分子动力学方法和弹性动力学方法研究了纳米铜线的动力屈曲，并对两种方法进行了比较。
Elastic dynamics method predicts that stress wave has remarkable effects on dynamic buckling of the nano crystal copper wire. Comparison with molecular dynamics resu...
用弹性动力学理论分析了应力波传播对纳米铜线的动力屈曲的影响，并与分子动力学模拟的结果进行了比较。
Elastic dynamics method predicts that stress wave has remarkable effects on dynamic buckling of the nano crystal copper wire. Comparison with molecular dynamic...
用弹性动力学理论分析了应力波传播对纳米铜线的动力屈曲的影响，并与分子动力学模拟的结果进行了比较。
The apoptosis in vascular endothelial cells induced by HCY plus copper was involved in the mechanism of oxidative stress-mediated injury.
HCY在生理浓度铜离子存在下可能通过氧化应激损伤的机制而导致血管内皮细胞凋亡。
The discussion on the temperature measuring techniques for liquid metal melts of copper, aluminum and the melt in a cementite furnace etc. is put stress on.
着重讨论了渗碳炉、铜、铝等液态金属熔体温度检测技术。
Obviously, submersed McRophytes were under the stress of copper.
说明了铜离子对沉水植物的生长产生了明显的胁迫。
Water had greater effect on MDA content than fertilization and copper, and drought stress obviously increased the MDA content and MDA/SOD values.
水分对MDA含量的影响大于铜污染和施肥，表现为干旱可显著增大叶片MDA含量，并使MDA/SOD值增大；
Cl ion was also found in oil glue by chemical analysis method. It was concluded that the cl ion in the oil glue resulted in stress corrosion cracking of the pure copper tube.
结果表明，紫铜管渗漏系腐蚀引发裂纹所致，而涂在铜管表面的油胶中的氯离子是引起紫铜管应力腐蚀开裂的主要因素。
The stress-strain curves of a copper wire and a structure adhesive film tested with the system are given.
最后采用该系统对金属铜丝和一种结构胶粘剂薄膜进行了拉伸测试。
Copper - Hemolysis, jaundice, changes in lipid profile, oxidative stress, renal dysfunction and even death.
铜元素——可能导致溶血症，黄疸，血脂病变，加速氧化衰老，肾功能障碍甚至死亡。
Copper - Hemolysis, jaundice, changes in lipid profile, oxidative stress, renal dysfunction and even death.
铜元素——可能导致溶血症，黄疸，血脂病变，加速氧化衰老，肾功能障碍甚至死亡。
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