But he hopes that depositing copper nanoparticles more evenly onto the surfaces of the nanotubes and making other improvements will help boost their conversion rates by a factor of several thousand.
但是他希望，通过在纳米管的表面更平均地沉淀铜纳米颗粒，结合其他一些改进，他们能够提高转化速率上千倍。
Proliferative effect of low energy laser and colony stimulating factor (CSF) on human umbilical cord blood hematopoietic cells was observed in vitro with copper vapour laser irradiation.
本研究用铜蒸气激光照射人脐带血造血细胞，观察低能量激光与集落刺激因子(CSF)对造血细胞的增殖作用。
The key factor of generator safe operation is affected by the corrosion of water internal coaling generator's hollow copper conductor.
水内冷发电机空芯铜导线的腐蚀问题是影响发电机安全运行的重要因素。
The optimal formula of the UV curable conductive adhesive gained from single factor test was as follows: Silver-plated copper powder 70%, complex photoinitiator 4%, AIBN 2% and KH570 2.5%.
通过单因素实验确定了导电胶的最佳配方：镀银铜粉填充量为70%、复合光引发剂用量为4%、热引发剂aibn用量为2%、偶联剂KH570用量为2.5%。
With domestic copper concentrate supply gap enlarging, recovering copper from slag can improve the service factor of resource.
在国内铜精矿资源缺口日益严重的情况下，从电炉弃渣中回收铜可提高资源综合利用率。
This study developed a view factor model to simulate the physical vapor deposition of copper interconnect in low pressure conditions using cylindrical targets.
研究开发了一个角系数模型来模拟低气压下圆柱靶溅射沉积铜连线。
The lower balance force with balance factor 0.89 is adapted to reduce bending of universal coupling shaft and load of copper slider.
提出接轴平衡力应该采用欠平衡，平衡系数取0.89，这样既可以降低接轴承受的弯矩，又可以降低接轴虎口铜滑块的载荷。
The "Copper-flow analysis with time factor of the life cycle of copper products" method was expatiated, and the flows of copper in China were analyzed by using this method.
前言：介绍了“具有时间概念的铜产品生命周期铜流分析方法”，并运用这种方法分析了我国铜的流动状况。
The ore control factor of the Huangshashi copper-lead-zinc deposit was analyzed comprehensively.
综合分析黄沙寺铜-铅-锌矿床的控矿因素。
Copper alloys for lead frame are becoming leading factor in the lead frame materials for IC, because of its high strength and high conductivity.
铜合金引线框架材料因其高强高导电性能而成为集成电路框架材料的主体。
Copper alloys for lead frame are becoming leading factor in the lead frame materials for IC, because of its high strength and high conductivity.
铜合金引线框架材料因其高强高导电性能而成为集成电路框架材料的主体。
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