A cyanide tin - copper plating process was optimized by means of orthogonal test. The effect of bath components of electrolytic solutions and electrodeposits was investigated.
采用正交试验研究了氰化镀铜锡合金工艺中各因素水平与镀液、镀层性能的关系，优选出一种最佳工艺配方。
The results show that the copper plated carbon fiber using optimized electroless copper plating process has even deposit, fine luster, good…
结果表明，采用优化后的碳纤维化学镀铜工艺制得的镀铜碳纤维镀覆均匀， 光泽性好， 镀层结合力强，导电性能显著提高。
Is the copper plating process an electrolytic acid copper plating system?
电镀站是否有酸解电镀铜系统？
The disadvantages of common electroless copper plating process were pointed out.
指出了普通镀铜工艺的缺点。
This paper introduced a copper plating process for micro-via filling and through hole plating simultaneously in DC application.
介绍了一种利用直流电源进行微盲孔和通孔同时电镀的工艺，同时给出了相关的工艺条件和电镀效果。
A new kind of non-cyanide alkaline strike copper plating process for zinc alloy die-castings was developed in order to solve the problems in traditional non-cyanide strike copper plating.
为解决传统的锌压铸件无氰预镀铜存在的一些问题，提出了一种新的锌合金压铸件无氰碱性预镀铜工艺。
A new non-cyanide alkaline copper plating process was introduced.
介绍了一种新的无氰碱铜工艺。
A new non-cyanide alkaline copper plating process was introduced.
介绍了一种新的无氰碱铜工艺。
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