The diagram below illustrates the component placement on the board.
如下图说明组成的位置董事会。
Improved component placement inspection and verification is performed by a pick and place machine (301).
由抓取式设备(301)实行改进的元件布局检查和确认。
The arming switch, S1, is connected with two short lengths of wire to the two holes marked S1 in the component placement diagram below.
武装开关，S1的，是与两短的长度线向两洞，标志着中一在组件的位置如下图。
A future article will also discuss the Application Placement Controller component, which is responsible for starting and stopping servers based on load requirements reported by ARFM, in more detail.
以后的一篇文章将详细讨论ApplicationPlacementController组件，它负责根据ARFM报告的负载需求启动和停止服务器。
For dynamic configuration, an additional ObjectGrid component, the Catalog Server, makes placement and other decisions for the whole topology.
对于动态配置，附加的ObjectGrid组件CatalogServer可针对整个拓扑做出放置和其他决定。
The human task assignment (User role Service component) handles the human task role placement or assignment for each process instance.
人工任务分配(userRoleService组件)处理人工任务角色安排或对每个流程实例的分配。
In relative location phase, it only needs to determine the relative location of macro circuit component, instead of all circuit components, by using the hierarchical property of placement.
在相对位置阶段，该算法利用布局的层次特性将需确定所有电路元件相对位置的问题缩减至仅需确定宏电路元件相对位置的问题；
Product placement component installation, interference. Shock resistance, and corrosion.
产品贴片元件安装、抗干扰，耐震动、耐腐蚀。
The digital SIPLACE vision system for the entire SIPLACE D-Series platform allows for digital data analysis and processing for faster and reliable component recognition and higher placement security.
整个SIPLACE D 系列平台都配备了SIPLACE数字成像系统，此系统可进行数字化分析和处理，提高了元件识别的速度和可靠性，具有更高的贴装安全度。
In general, HabaSYNC belts are used in applications where exact product placement and precise component positioning is required.
一般情况下，HabaSYNC安全带是在准确的产品定位和精确的组件定位是必需的应用程序使用。
In addition, Thermal Force-Directed Placement Algorithm is used, detailed analysis of the device optimized layout of the component junction temperature and the average PCB temperature are shown.
另外，本文还运用热力导向优化算法，分析了电子元器件的优化布局对元器件的结点温度的影响。
In addition, Thermal Force-Directed Placement Algorithm is used, detailed analysis of the device optimized layout of the component junction temperature and the average PCB temperature are shown.
另外，本文还运用热力导向优化算法，分析了电子元器件的优化布局对元器件的结点温度的影响。
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