The COF/MEMS packaging technology is well-suited for many microsystem packaging applications such as micro-optics and radio frequency(RF) devices.
COF/MEMS封装技术非常适合于诸如微光学及无线射频器件等很多微系统封装的应用。
This paper describes the characteristic and fabrication technology of COF(Chip on Film)tape for large-scale LCD(Liquid Crystal Display), and fine pitch wiring formation technology.
概述了大型液晶显示用COF带的特征和制造技术以及细节距线路形成技术。
COF is a high performance, multichip packaging technology in which dies are encased in a molded plastic substrate and interconnects are made via a thin-film structure formed over the components.
COF是一种高性能、多芯片封装工艺技术，在此封装中把芯片包入模塑塑料基板中，通过在元器件上形成的薄膜结构构成互连。
COF is a high performance, multichip packaging technology in which dies are encased in a molded plastic substrate and interconnects are made via a thin-film structure formed over the components.
COF是一种高性能、多芯片封装工艺技术，在此封装中把芯片包入模塑塑料基板中，通过在元器件上形成的薄膜结构构成互连。
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