Resist: coating material used to mask or to protect selected areas of a pattern from the action of an etchant solder or plating.
阻剂：用来选择性保护某图形区域免受蚀刻剂，焊料或电镀影响的涂层材料。
In the test the solder ability plating coating.
在测试电镀镀层的焊锡能力。
In addition, the solder mask coating on printed circuit board, with the plasma treatment, can also obtain certain roughness and high active surface, thus improving the solder coating adhesion.
另外，在阻焊膜涂覆前，用等离子体对印制电路板面处理一下，还可获得一定的粗糙度和高活性的表面，从而提高阻焊膜层的附着力。
FDZ-5B coating process is a low-cost and good replacement of hot-air solder leveled process and other metal finishing processes.
FDZ 5b有机保焊涂覆工艺是一种价廉物美的取代热风整平和其它金属精饰的新工艺。
Screen Print: Solder mask coating will cover completely the panel holes, pads and traces, on both sides.
网印：在板两面完全涂覆阻焊油墨，包括导通孔、焊盘。
Areas that should not be soldered to may be covered with a polymer solder resist (solder mask) coating.
区域，不应该被焊接到可以覆盖着一层焊抵抗焊接罩聚合物涂料。
Therefore, electroplating of lead-free solder coating is one of investigation hotspots in electronic electroplating field.
因此，电沉积无铅可焊性镀层是电子电镀领域的研究热点之一。
PCBA conformal coating, dam process, Solder mask coating, DIP Component fixing.
PCBA表面三防涂覆、堤坝工艺、涂防焊胶、DIP元件加固等。
Soldering on ADI surface decreased the ADI tensile strength and elongation, and solder coating could not prevent from water embrittlement.
试样表面镀锡使ADI的抗拉强度和伸长率下降，镀锡层不能有效防止ADI的水脆化。
The coating has excellent solder properties and can be used on the surfaces of printed circuit board and patch-like electronic apparatus in order to carry out lead-free electronic packing.
该镀层的可焊性优良，可作为印刷电路板和元器件的表面镀层，从而实现电子封装的无铅化。
The coating has excellent solder properties and can be used on the surfaces of printed circuit board and patch-like electronic apparatus in order to carry out lead-free electronic packing.
该镀层的可焊性优良，可作为印刷电路板和元器件的表面镀层，从而实现电子封装的无铅化。
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