A circular tube-like gap (S1) in which a plating liquid (17) flows is formed between the tubular electrode placed in the hollow section and an inner peripheral wall (14) of the hollow section.
圆管状间隙（S1）在放置在中空段内的管状电极与中空段的内周壁（14）之间形成，电镀液在该 间隙（S1）中流动。
A circular tube-like gap (S1) in which a plating liquid (17) flows is formed between the tubular electrode placed in the hollow section and an inner peripheral wall (14) of the hollow section.
圆管状间隙（S1）在放置在中空段内的管状电极与中空段的内周壁（14）之间形成，电镀液在该 间隙（S1）中流动。
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