• The present invention provides a camera body which can prevent damage caused by overheating of a main circuit substrate.

    本发明提供一种能够防止主电路基板因热而导致破损的照相机主体。

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  • According to the invention, the vibrating motor is prevented from overturning when being mounted on the circuit substrate.

    根据本发明,可以防止振动马达单元在安装于电路基板上时所出现的翻倒情况。

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  • The driving circuit substrate is disposed between the mold frame and the bottom chassis, and includes a circuit component.

    驱动电路基板设置在模制框架和底壳之间,并包括电路元件。

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  • The pads and vias of the sacrificial circuit substrate are placed (64) in vertical proximity to the excess solder of the circuit substrate.

    该牺牲电路基板的焊盘和孔与该电路基板的多余焊料垂直接近地放置(64)。

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  • The circuit substrate (100) is provided with an aperture region. As the speaker (2) is disposed on that region, a test sound wave is output to the moving section of the microstructure.

    而且,在电路基板(100)中设置开口区域,在其上装载扬声器(2),由此对微小结构体的可动部输出测试声波。

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  • A method for vertical removal of excess solder from a circuit substrate includes the use of a sacrificial circuit substrate (60) with a plurality of pads and vias that are solder-wettable.

    一种用于从电路基板垂直去除多余焊料的方法,该方法包括利用具有可吸附焊料的多个焊盘和孔的牺牲电路基板(60)。

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  • The first pixel includes a first pixel driving circuit that overlies the substrate and includes a first electronic component.

    所述第一像素包括覆盖在所述衬底上方的第一像素驱动电路,并包括第一电子部件。

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  • Selfnegative bias on insulate substrate surface of rf glow discharge plasma reactors is studied theoretically. The mathematical analysis has been obtained by equivalent circuit method.

    讨论了高频辉光放电等离子体系统中绝缘衬底表面的自负偏压问题,用等效电路方法给出了自负偏压的数学解析。

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  • The equivalent circuit model gives the instantaneous relationship between the sheath thickness and the surface potential at an insulating substrate placed on the pulse-biased electrode.

    模型包括离子连续性方程、动量方程和泊松方程,特别是提出了可以自洽地决定绝缘基板表面电势、表面电荷密度和鞘层厚度关系的等效电路方程。

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  • This paper introduced a new copper treatment agent ST-10+ for improving the adhesion of dry film to printed circuit board copper substrate.

    本文介绍了一种能提高干膜与线路板铜基粘合力的新型铜面处理剂ST-10+。

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  • In the article, we make a parasitic substrate model on the existing MOS model, and use this model to do simulation for each single MOS, accumulated effect circuit and some useful analog circuit.

    在文章中,我们在现有的MOS器件模型的基础上再组建一个寄生的衬底模型,然后利用此模型逐一对单个MOS器件,具有累积效应的数字电路和部分基本模拟电路进行了仿真实验和分析。

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  • From the simulation data, we can clearly observe the instability of substrate voltage, caused by substrate resistor, will cause some trouble in both analog and digital circuit.

    从仿真的数据结果,我们可以清楚地认识到衬底寄生电阻所带来的衬底电压的不稳无论在数字电路还是模拟电路中都会产生一定的影响。

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  • It is used as protect coating of rigid and flexible circuit board, for example: it serves as coat of thick film circuit, porous membrane substrate and prefabricated circuit.

    用于刚性及柔性电路板的保护涂料,如厚膜电路系统,多孔基材及印刷电路的涂层。

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  • These measurements include temperature and ir drop at locations on the semiconductor substrate, along with the frequency response of integrated circuit.

    这些测量包括半导体衬底上的各位置处的温度和IR降、以及集成电路的频率响应。

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  • A transistor circuit for an array device comprises a plurality of thin film transistors electrically connected in parallel and provided on a common substrate.

    一种用于阵列器件的晶体管电路包括并联电连接且设置在同一衬底上的多个薄膜晶体管。

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  • A wiring and interlayer dielectric layer may be formed over the first substrate including the readout circuit.

    可在包括读出电路的第一衬底上方形成布线和层间介电层。

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  • The second substrate includes a power plane deposited at a position of a component mounted to the printed circuit board (PCB) to transmit power to the component.

    第二基板包括电力平面,该电力平面安置在组件的被安装到印刷电路板的位置处以向组件传输电力。

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  • In real circuit design, same device performs differently when in various substrate status. That's why we need to establish an effective method to detect substrate effects.

    在实际的芯片设计中由于衬底情况的不同而导致的器件性能差异促使我们需要建立一种研究衬底情况的方法。

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  • The RF self-bias of the substrate in an RF inductively coupled plasma is controlled by changing the impedance of an external circuit inserted between the substrate and the ground.

    采用调节射频电感性耦合等离子体中基片电极与地之间的外部电路阻抗的方法,控制基片电极的射频自偏压。

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  • Main materials of printed circuit board (PCB) substrate were macromolecule resins, which were typical viscoelatic materials.

    电路板基板材料主要以高分子树脂为主,是典型的黏弹性材料。

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  • The shape of the liquid crystal display device as a whole can be reduced by the formation of the resistance element and other peripheral circuit on the substrate of a liquid crystal panel.

    通过在液晶板的基板上形成电阻元件或其它外围电路可以使液晶显示装置的整体形状变小。

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  • A transparent multilayered sheet, a circuit board, and an optical waveguide are also provided which use a transparent substrate formed from this fiber-reinforced composite material.

    本发明还提供使用由该纤维增强复合材料制成的透明基板的透明多层片、电路板和光波导。

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  • This paper describes the current state and trend of external inspection technology of printed circuit board and mounting substrate.

    概述了印制板和安装基板的外观检查技术的现状和动向。

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  • The camera component comprises the circuit board and a camera module, wherein the camera module comprises a lens module, an image sensor and a substrate.

    所述相机组件包括所述电路板和一个相机模组,所述相机模组包括一个镜头模组、一个影像感测器和一个基板。

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  • The sensor substrate includes: at least a corrent electrode, supplying the detected signal to the circuit disconnectedly;

    传感器基板包括:至少一个供电电极,向电 路非接触地提供检查信号;

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  • Measurement circuit components are included in an integrated circuit fabricated on a semiconductor substrate.

    本发明涉及一种用于调整供应给电路的电压的集成电路、电子系统和方法。

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  • The present invention provides a thin film transistor substrate realizing reduced interlayer short-circuit defects in a capacitor, and a display device having the thin film transistor substrate.

    本发明提供了一种薄膜晶体管衬底和具有这种薄膜晶体管衬底的显示装置,这种薄膜晶体管衬底能够减小电容器中的层间短路缺陷。

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  • The third substrate layer has an integrated circuit to exchange one or more radio frequency (RF) signals with the first and second pluralities of array elements.

    第三基底层有用以与第一和第二多个阵列元件交换一个或多个射频(RF)信号的集成电路。

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  • The invention relates to a band-pass filter which is used on organic substrates. The band-pass filter comprises a plurality of organic substrate layers and a plurality of circuit layers;

    本发明是关于一种应用于有机基板的带通滤波器,其包括:数个有机 基板层及数个电路层。

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  • The relatively constant values of open circuit voltage suggest the electrolyte layer withstands thermal shock due to high thermal conductivity and excellent ductibility of the metal substrate.

    相对恒定的开路电压显示,电解质层经受住了热冲击,此受益于金属支撑体良好的导热性和延展性。

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