The surface micromachining process uses either crystal silicon chip substrates as a foundation upon which to build layers, or can be started on cheaper glass or plastic substrates.
表面微加工工艺采用两种晶体硅芯片基板作为赖以建立层的基础，或者可以在更便宜的玻璃或塑料基板启动。
Chip scale package (CSP) for flip-chip on hard substrates and wafer re-distribution is studied, and its process flow is described.
对刚性基板倒装式和晶圆再分布式两种结构的芯片级封装（CSP）进行了研究，描述了CSP的工艺流程；
On the other hand, off-chip inductors on low loss substrates deliver much higher Q values.
另一方面，低功耗基板上的片外电感器能够提供较高的Q值。
To investigate the sensor packaging effect, the finite element method is adopted for analyzing the distribution of residual stress in the multi-sensor chip with FR4 substrates.
针对集成传感器芯片封装粘贴过程中的残余应力影响器件性能的问题，使用有限元方法对环氧粘胶粘贴集成传感器芯片产生的封装残余应力进行了分析。
To investigate the sensor packaging effect, the finite element method is adopted for analyzing the distribution of residual stress in the multi-sensor chip with FR4 substrates.
针对集成传感器芯片封装粘贴过程中的残余应力影响器件性能的问题，使用有限元方法对环氧粘胶粘贴集成传感器芯片产生的封装残余应力进行了分析。
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