ChinaABSTRACT: Objective to select an optimal non-specific antigen blocking method by using immuno-infiltration assay so as to suit protein chip preparation.
目的选择理想的非特异性抗原封闭方法以适应基于免疫渗滤法的蛋白芯片制备。
Quality control of preparation technique is the key to develop technique performance of the piezoelectric protein sensing chip.
对压电蛋白传感芯片制备工艺进行质量控制，是提高芯片技术性能的关键。
The present invention relates to a protein chip applicable to high-flux medicine screening process, its preparation technique and detection method.
本发明涉及一种适用于高通量药物筛选的蛋白质芯片，及其制备技术及其检测方法。
It integrates the experimental sample preparation, biochemical process and result measure on single chip for certain analytic purposes.
它将试验样品的制备、生化反应和结果检测三个步骤集成在单一器件上，能执行特定的分析功能。
The invention provides a preparation method of a chip-typed air discharging protection component, comprising a copper electrode couple preparation step and a hollow air chamber preparation step.
一种芯片型空气放电保护组件的制备方法，包括有铜电极偶制备步骤以及中空气室 制备步骤；
Microfluidic chip technology has the preparation of simple, low reagent use, easy to operate, etc. , so in the biochemical analysis of the growing attention.
微流控芯片技术具有制备简单、试剂用量少、操作方便等优点，因此在生化分析中的应用越来越受到重视。
The invention relates to an application of a one-step detection method in the detection and analysis method of Down syndrome, and a preparation method for a chip used in the detection.
本发明涉及一步检测法在唐氏综合征检测、分析方法中的应用及检测中所用芯片的制备方法。
The invention relates to a nucleic acid chip and a preparation method and application thereof, belonging to the detection field of enzymes, microorganisms or nucleic acid molecules.
本发明涉及核酸芯片、其制备方法及用途，属于酶、微生物或者核酸分子的检测领域。
The invention belongs to the technical field of integrated circuits, in particular to a self-powered low power consumption integrated circuit chip and a preparation method thereof.
一种自供电低功耗集成电路芯片，其特征在于，该芯片包括一个半导体衬底以及在该衬底上的低功耗集成电路和太阳能电池；
The invention belongs to the technical field of integrated circuits, in particular to a self-powered low power consumption integrated circuit chip and a preparation method thereof.
一种自供电低功耗集成电路芯片，其特征在于，该芯片包括一个半导体衬底以及在该衬底上的低功耗集成电路和太阳能电池；
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