• Electrical circuitry is disposed on the dielectric coating, said circuitry including chip mounting pads, connection pads and circuit traces connecting the chip mounting pads to the connection pads.

    在介质涂层上设置电路,后者包括芯片安装焊盘,连接焊盘和连接它们的电路迹线。

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  • In SMT used as the fourth generation of electronic mounting technology chip aluminium electrolytic capacitors are indispensable components.

    表面贴装技术是第四代电子组装技术,片式铝电解电容器是这一技术中不可缺少的元件。

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  • Angle recognition for chip component is one of the most difficult issues in electronics manufacturing, and it has direct impact on the mounting precision.

    元件角度识别是贴片机元件视觉检测的关键,其参数的精确获取直接影响贴片机进行元件贴装的准确性。

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  • A package for mounting an integrated circuit chip to a circuit board or the like is provided.

    提供在电路板等上安装集成电路芯片的封装。

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  • Provided are a chip component mounting structure and a chip component mounting method for increasing density.

    本发明涉及可实现高密度化的芯片部件的安装构造以及安装方法。

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  • Permits automatic mounting to printed circuit boards using a chip mounter.

    此小巧体积设计,可在印刷电路板中使用自动机器插件。

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  • Automatic mounting can be done by an ordinary chip mounter.

    自动安装,可以由一个普通的贴片机。

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  • The invention is used for mounting the chip.

    本发明用于贴装芯片。

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  • The invention is used for mounting the chip.

    本发明用于贴装芯片。

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