Failure analysis is conducted for the single chip packaging process of an advanced high-range MEMS accelerometer with double cantilever beams.
对一种先进的双悬臂梁高量程MEMS加速度计的单芯片封装工艺进行了失效机理分析。
Based on the analysis, it discovers some failure modes, such as the chip surface pollutants and internal chip faults, that are difficult to be detected by the existing methods.
通过分析发现了一般分析难以检测到的表面污染物污染、内部芯片断层等失效模式。
Based on the analysis, it discovers some failure modes, such as the chip surface pollutants and internal chip faults, that are difficult to be detected by the existing methods.
通过分析发现了一般分析难以检测到的表面污染物污染、内部芯片断层等失效模式。
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