It proves that the designed parallel bonding mechanism meets the working requirements of IC Chip Die by these characteristic curves.
根据这些曲线，说明所设计的并联焊头机构能满足IC芯片粘片机的工作要求。
More important than the CPU cores, however, is the fact that half the chip die is now taken up by the graphics-processing circuitry.
然而，比CPU核心，更重要的是一半的芯片模具现在采取的图形处理电路。
Based on these characteristic curves, it proves that the moving stiffness of the designed Parallel Bonding Mechanism meets the working requirements of IC Chip Die.
根据这些曲线，说明所设计的并联焊头机构的动刚度能满足IC芯片粘片机的工作要求。
Lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit Flip Chip packages.
集成电路倒装芯片封装中半导体芯片及载体之间形成可靠联接所用焊料中的铅。
Lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit Flip Chip packages.
集成电路倒装芯片封装中半导体铸模和载波器的焊料中的铅；
Antagonizing a bear with a chocolate chip cookie or ballet dancing on the beach during a tsunami is a stupid way to die.
用巧克力饼干激怒一只熊或在海啸时的海滩上跳芭蕾是一个愚蠢的死亡方法。
Intel will be launching its Larrabee chip next year - a chip that will live or die depending on how popular it is with game developers.
英特尔将推出其拉拉明年芯片-芯片，将生或死的受欢迎程度如何取决于它是与游戏开发商。
The GPU functions appear to be bolted on to a GPGPU oriented 'generalist' chip, something strongly supported by the die size: performance ratio.
GPU的职能似乎被固定到一个通用图形处理器面向'多面手'芯片，强烈裸片尺寸：性能比支持的东西。
Plasma systems 400 and 660 are low-pressure microwave plasma systems for cleaning advanced chip packages prior to die attach, wire bond and encapsulation.
等离子体400和660系列是低压微波等离子体应用于提高模具粘合，引线的焊接，特别是清洗高级的芯片封装。
This wafer level chip size package (WL-CSP) process encases the die in a solid die-size glass shell.
圆片级芯片尺寸封装（WL-CSP）工艺是在固态芯片尺寸玻璃外壳中装入芯片。
Die Bonder is manufacturing equipment which binds IC chip onto Lead Frame in semiconductor production.
机是用于将IC芯片粘结到引线框架的半导体器件生产专用装备。
Testing the "system on a chip" Much has been written about the concept of a "system on a chip," the ever-increasing integration of logic and analog functions on one silicon die or chip.
测试芯片上的“系统”很多人已写了一个“片面系统”的概念，逻辑和模拟功能不断增长的集成在一个硅芯片或芯片。
The design describes the structure of compound die stamping flip-chip design and working process.
本次设计阐述了冲压倒装复合模的结构设计以及工作过程。
It is important to note that the cost of off-chip inductors is mitigated by the removal of the large area on-chip passive inductors from the expensive submicron CMOS die area.
重要的是注意到，片外电感器的成本通过从昂贵的亚微米cmos裸片移去占面积较大的片上被动电感而得以节省。
Annotated die image of the XC3028 single-chip analog and digital TV tuner showing the fully integrated RF-to-baseband functional blocks.
注明模具的形象，该xc 3028的单芯片模拟和数字电视调谐器显示完全集成的射频到基带功能块。
The system can process wafers up to 200mm in diameter and includes die inversion for flip chip applications.
该系统可以处理直径多达200毫米的晶片，包括模具的倒装。
The system can process wafers up to 200mm in diameter and includes die inversion for flip chip applications.
该系统可以处理直径多达200毫米的晶片，包括模具的倒装。
应用推荐